Dr. Douglas H. Morais received a Ph.D from University of Ottawa, Canada, an M.Sc from the University of California, Berkeley, California, and a B.Sc from the University of Edinburgh, Scotland, all in Electrical Engineering. Additionally, he is a Graduate of the AEA/Stanford Executive Institute, Stanford University, California, a Life Senior member of the IEEE Communications Society, and a member of the IEEE Communications Society. After decades in the industry, he is currently a technical book author, short course lecturer, and inventor. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. He is the author of "Fixed Broadband Wireless Communications," Pearson Education, Inc., 2004, "5G and Beyond Wireless Transport Technologies," Springer, 2021, "5G NR, Wi-Fi 6, and Bluetooth LE 5," Springer, 2023, and "Key 5G/5G-Advanced Physical Layer Technologies, Third Edition" Springer, 2024. He has three US patents, including two on digital modulation and one on point-to-multipoint communication.