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Dr. Douglas H. Morais holds a Ph. D. from the University of Ottawa, Canada, an M.Sc. from the University of California, Berkeley, and a B.Sc. from the University of Edinburgh, Scotland, all in electrical engineering. Additionally, he is a graduate of the AEA/Stanford Executive Institute, Stanford University, California, is a Life Senior member of the IEEE, and a member of the IEEE Communications Society. After decades in industry, he is currently a technical book author, short course lecturer, and inventor. Previously, he was President of the Wireless Group at Ortel Corporation and both Executive Vice President, Business Development and Technology and President, Wireless Products Group at California Microwave, Inc. In addition to this text, he is the author of "Fixed Broadband Wireless Communications," Pearson Education, Inc., 2004, "5G and Beyond Wireless Transport Technologies," Springer Publishing, 2021, and "5G Nr, Wi-Fi 6, and Bluetooth LE5", Springer Publishing, 2023. He holds three US patents, including two on digital modulation and one on point-to-multipoint wireless communication.
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